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  4. Highly heat -driven high heat dissipation FPC new structure for FPC equipped with LED (Maruwa Seisakusho Co., Ltd.)

Highly heat -driven high heat dissipation FPC new structure for FPC equipped with LED
Maruwa Seisakusho Co., Ltd.

About This Product

■ Characteristics

・ LED and joining temperature can be reduced by 10%or less. ・ Extend the life of LEDs by about 10%to 20%. ・ It is realized at low cost without using expensive special materials.

■ Recruitment example

In -vehicle lamps, design lighting, etc.

■ What is FPC?

A structure with a conductor on a thin plastic insulating film is called a flexible substrate (FPC).

■ FPC usage use

As demand for high -performance and high -density of light -powered devices increases, the demand for flexible printing wiring (FPC) is increasing. The FPC is thin and can be folded freely, is extremely lightweight, and can be used effectively. The Maruwa Works will apply the unique technology cultivated in -house to meet the needs of our customers.

  • Product

    Highly heat -driven high heat dissipation FPC new structure for FPC equipped with LED

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0 Models of Highly heat -driven high heat dissipation FPC new structure for FPC equipped with LED

Image Part Number Price (excluding tax) Bonding temperature decrease rate Heat sink back temperature Joint temperature

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About Company Handling This Product

Maruwa Seisakusho Co., Ltd.

  • Japan

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