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Laser related laser via cutter-EC-11
Laser related laser via cutter-Shibuya Optical Co., Ltd.

Laser related laser via cutter
Shibuya Optical Co., Ltd.


About This Product

■Laser via cutter

・Integrated head unit that uses the Bessel beam principle to extend the depth of focus of the laser beam. ・A wide range of depth of focus can be provided within a wide range of 0.15mm to 5mm. ・Achieves a mirror-like effect on the processed end surface, allowing easy braking ・Supported wavelengths: 532nm, 1,064nm

■Applications

・Micro-fabrication of full-display cell phone cover glass ・Cutting of protective glass for mobile phone cameras ・Sapphire cutting processing ・Cutting processing of silicon and liquid crystal panels

  • Product

    Laser related laser via cutter

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1 Models of Laser related laser via cutter

Image Part Number Price (excluding tax) Spot diameter um Working distance WD Incident beam diameter Wavelength Depth of focus DOF
Laser related laser via cutter-Part Number-EC-11

EC-11

Available upon quote

2

9mm

8mm

1,064nm

1.0mm

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