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Tabletop ultrasonic jet tank
Resaw Giken Co., Ltd.


About This Product

Desktop ultrasonic jet baths using ultrasonic solder jet the solder and always bond clean (oxide-free) solder to the base material, so no bridges or oxides are generated. Solder clean solder using ultrasonic vibration. Usage example

■Example 1 Solder dipping to aluminum wire

In recent years, when developing the winding wire used in motors, inverter transformers, and IH transformers from copper wire to aluminum wire, not only performance considerations but also terminal treatment issues have become an issue, so we introduced a simple dip bath to streamline development.

■Example 2 Solder dipping to flexible board

Application ② Solder dip on flexible substrates Development is progressing in the printing of electronic circuits on film, glass, and paper, including substrates for IC cards (CEATEC2014). As it becomes possible to print fine patterns on flexible substrates, we propose ultrasonic solder dipping to ensure the thin film thickness of the pattern, which is an issue, and to confirm reliability.This makes it possible to secure the pattern film thickness and lower the resistance value, as well as to perform solder plating for mounting components.

■Example 3 Solder dipping to aluminum wire

As a way to increase the bonding strength, you can use an ultrasonic jet bath to solder dip the electric wire (flat wire) and the aluminum terminal, making it easier to join than using a soldering iron. If the parts are made of aluminum instead of copper, the power of ultrasonic waves will be more effective.

■Example 4 Solder dip to superconductivity

We simultaneously perform bonding of superconducting materials (NbTi type), etc. and copper metal plates (wires), and solder plating. Two types of wire rods are stacked and placed in a solder jet bath, and while applying ultrasonic waves, it is possible to join the wire rods and perform solder plating at the same time.

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    Tabletop ultrasonic jet tank

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