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  4. Tabletop ultrasonic jet tank (Resaw Giken Co., Ltd.)
Tabletop ultrasonic jet tank-Tabletop ultrasonic jet tank
Tabletop ultrasonic jet tank-Resaw Giken Co., Ltd.

Tabletop ultrasonic jet tank
Resaw Giken Co., Ltd.

About This Product

Desktop ultrasonic jet baths using ultrasonic solder jet the solder and always bond clean (oxide-free) solder to the base material, so no bridges or oxides are generated. Solder clean solder using ultrasonic vibration. Usage example

■Example 1 Solder dipping to aluminum wire

In recent years, when developing the winding wire used in motors, inverter transformers, and IH transformers from copper wire to aluminum wire, not only performance considerations but also terminal treatment issues have become an issue, so we introduced a simple dip bath to streamline development.

■Example 2 Solder dipping to flexible board

Application ② Solder dip on flexible substrates Development is progressing in the printing of electronic circuits on film, glass, and paper, including substrates for IC cards (CEATEC2014). As it becomes possible to print fine patterns on flexible substrates, we propose ultrasonic solder dipping to ensure the thin film thickness of the pattern, which is an issue, and to confirm reliability.This makes it possible to secure the pattern film thickness and lower the resistance value, as well as to perform solder plating for mounting components.

■Example 3 Solder dipping to aluminum wire

As a way to increase the bonding strength, you can use an ultrasonic jet bath to solder dip the electric wire (flat wire) and the aluminum terminal, making it easier to join than using a soldering iron. If the parts are made of aluminum instead of copper, the power of ultrasonic waves will be more effective.

■Example 4 Solder dip to superconductivity

We simultaneously perform bonding of superconducting materials (NbTi type), etc. and copper metal plates (wires), and solder plating. Two types of wire rods are stacked and placed in a solder jet bath, and while applying ultrasonic waves, it is possible to join the wire rods and perform solder plating at the same time.

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    Tabletop ultrasonic jet tank

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1 Models of Tabletop ultrasonic jet tank

Image Part Number Price (excluding tax) Solder temperature Size Solder bath internal shape Size External shape of solder bath Size External shape of electrical equipment Chip thickness Chip width Heater solder temperature Ultrasonic specifications Possible chip dimensions Ultrasonic specifications Ultrasonic frequency Ultrasonic specifications Ultrasonic oscillation output Ultrasonic vibration Power supply voltage Solder bath Power supply voltage Ultrasonic oscillator
Tabletop ultrasonic jet tank-Part Number-Tabletop ultrasonic jet tank

Tabletop ultrasonic jet tank

Available upon quote

400℃ (max)

200 (W) ×200 (D) ×150 (T)

400 (W) ×750 (D) ×350 (T)

430 (W) ×550 (D) ×299 (T)

10mm

50mm

400℃max (power supply 100V) /500℃max (power supply 200V)

Within width 50mm x height 10mm

60KHz/40KHz/28KHz/20KHz

Low output 1~20W/Medium output 10~60W/High output 30~150W

150W (max)

Single phase 100V/Single phase 200V

100~240V multi power supply

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