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  4. Semiconductor device materials Liquid materials and adhesives for mounting reinforcement “LEXCM DF” series (Panasonic Industry Co., Ltd.)
Semiconductor device materials Liquid materials and adhesives for mounting reinforcement “LEXCM DF” series-CV5797
Semiconductor device materials Liquid materials and adhesives for mounting reinforcement “LEXCM DF” series-Panasonic Industry Co., Ltd.

Semiconductor device materials Liquid materials and adhesives for mounting reinforcement “LEXCM DF” series
Panasonic Industry Co., Ltd.

About This Product

■Product overview

Secondary mounting reinforcement for semiconductor packages such as CSP/BGA, adhesive bonding for camera modules/image sensors Target packages: CSP / BGA / Image sensor / WLCSP / QFN / MLCC etc.

■High heat resistance secondary mounting side fill material CV5797

・Supports large size PKG ・Glass transition temperature 160℃ ・Pot life 72 hours ・Frozen storage ・Easy to inspect

■High heat resistance secondary mounting underfill material CV5794

・Glass transition temperature 160℃ ・Pot life 72 hours ・Frozen storage

■Low temperature curing secondary mounting underfill material CV5350AS

・Low temperature curing 80℃ ・Tg150℃ or more ・High flow

■Drop impact resistant liquid encapsulant for secondary mounting reinforcement CV5313, CV5314

・Drop impact resistance ・Underfill/side fill reinforcement

  • Product

    Semiconductor device materials Liquid materials and adhesives for mounting reinforcement “LEXCM DF” series

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1 Models of Semiconductor device materials Liquid materials and adhesives for mounting reinforcement “LEXCM DF” series

Image Part Number Price (excluding tax)
Semiconductor device materials Liquid materials and adhesives for mounting reinforcement “LEXCM DF” series-Part Number-CV5797

CV5797

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Panasonic Industry Co., Ltd.

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