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  4. Semiconductor device materials: Encapsulant “LEXCM CF” series for automotive and industrial equipment (Panasonic Industry Co., Ltd.)
Semiconductor device materials: Encapsulant “LEXCM CF” series for automotive and industrial equipment-CV8213
Semiconductor device materials: Encapsulant “LEXCM CF” series for automotive and industrial equipment-Panasonic Industry Co., Ltd.

Semiconductor device materials: Encapsulant “LEXCM CF” series for automotive and industrial equipment
Panasonic Industry Co., Ltd.

About This Product

■Product overview

Achieving improved reliability of semiconductor packages such as power devices that require automotive quality Power device

■Delamination-free surface mount encapsulant CV8213 for automotive semiconductor packages

・High adhesion, low stress ・In-vehicle reliability standards ・Clip bond PKG compatible

■High thermal conductive encapsulant for power modules CV4180, CV4380

・High heat dissipation ・Lower stress ・High adhesion

■High heat-resistant semiconductor encapsulant for power devices CV8540

・High heat resistance ・Low warpage/low stress ・High insulation

  • Product

    Semiconductor device materials: Encapsulant “LEXCM CF” series for automotive and industrial equipment

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1 Models of Semiconductor device materials: Encapsulant “LEXCM CF” series for automotive and industrial equipment

Image Part Number Price (excluding tax)
Semiconductor device materials: Encapsulant “LEXCM CF” series for automotive and industrial equipment-Part Number-CV8213

CV8213

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Panasonic Industry Co., Ltd.

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