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  4. Semiconductor device materials “LEXCM CF” and “LEXCM DF” series, encapsulant materials for advanced semiconductor packages (Panasonic Industry Co., Ltd.)
Semiconductor device materials “LEXCM CF” and “LEXCM DF” series, encapsulant materials for advanced semiconductor packages-CV8511CUB
Semiconductor device materials “LEXCM CF” and “LEXCM DF” series, encapsulant materials for advanced semiconductor packages-Panasonic Industry Co., Ltd.

Semiconductor device materials “LEXCM CF” and “LEXCM DF” series, encapsulant materials for advanced semiconductor packages
Panasonic Industry Co., Ltd.

About This Product

■Product overview

Improved reliability of advanced semiconductor packages such as wafer level packages, FC CSP/BGA, and Wifi modules WLP/PLP

■Semiconductor encapsulant for FOWLP/PLP | CV8511CUB

・Low stress ・Low shrinkage rate ・Low temperature curing FC CSP/FC BGA

■Semiconductor encapsulant CV8581, CV8713 compatible with mold underfill

・Reduced process time ・Narrow gap/pitch filling ・Low warpage

■Semiconductor encapsulant CV5300 compatible with capillary underfill

・High fluidity ・Narrow gap/pitch filling ・Low void/low bleed

■Thin surface mount encapsulant CV8710, CV8760

・Thin type compatible ・High-density wiring ・Warpage control Wifi module

■Low-warpage liquid encapsulant for SMD modules CV5386, CV5401

・Warpage control ・High adhesion ・Solder flash suppression

  • Product

    Semiconductor device materials “LEXCM CF” and “LEXCM DF” series, encapsulant materials for advanced semiconductor packages

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1 Models of Semiconductor device materials “LEXCM CF” and “LEXCM DF” series, encapsulant materials for advanced semiconductor packages

Image Part Number Price (excluding tax)
Semiconductor device materials “LEXCM CF” and “LEXCM DF” series, encapsulant materials for advanced semiconductor packages-Part Number-CV8511CUB

CV8511CUB

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