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  4. Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series Low thermal expansion semiconductor package substrate materials R-1515A (Panasonic Industry Co., Ltd.)
Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series Low thermal expansion semiconductor package substrate materials R-1515A-R-1515A
Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series Low thermal expansion semiconductor package substrate materials R-1515A-Panasonic Industry Co., Ltd.

Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series Low thermal expansion semiconductor package substrate materials R-1515A
Panasonic Industry Co., Ltd.

About This Product

■Substrate material for semiconductor packages “LEXCM GX” series

Achieving thinner, smaller, and less warped semiconductor packages

■Low thermal expansion semiconductor package substrate material

It has excellent elasticity and heat resistance, and contributes to the higher functionality of large packages due to increased pin count and transmission circuit integration.

■Applications

semiconductor package substrate

■Main characteristics

・Flexural modulus 25℃ 27GPa ・CTE x, y-axis 11-13ppm/℃ ・Tg (DMA) 205℃

  • Product

    Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series Low thermal expansion semiconductor package substrate materials R-1515A

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1 Models of Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series Low thermal expansion semiconductor package substrate materials R-1515A

Image Part Number Price (excluding tax) Glass transition temperature (Tg) °C Flexural modulus GPa Dielectric constant (Dk) Thermal decomposition temperature (Td) °C Thermal expansion coefficient (vertical/horizontal direction) ppm/℃ Dissipation factor (Df)
Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series Low thermal expansion semiconductor package substrate materials R-1515A-Part Number-R-1515A

R-1515A

Available upon quote

205

25℃: 27
250℃: 10

4.8

390

12

0.015

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