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Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series High elasticity/low thermal expansion semiconductor package substrate materials R-1515W-R-1515W
Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series High elasticity/low thermal expansion semiconductor package substrate materials R-1515W-Panasonic Industry Co., Ltd.

Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series High elasticity/low thermal expansion semiconductor package substrate materials R-1515W
Panasonic Industry Co., Ltd.


About This Product

■Substrate material for semiconductor packages “LEXCM GX” series

Achieving thinner, smaller, and less warped semiconductor packages

■High elasticity/low thermal expansion semiconductor package substrate material

Provides excellent elastic modulus and further heat resistance, contributing to higher functionality of large packages due to increased pin count and transmission circuit integration.

■Applications

semiconductor package substrate

■Main characteristics

・Flexural modulus 25℃ 35GPa ・CTE x, y-axis 9ppm/℃ ・Tg (DMA) 250℃

  • Product

    Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series High elasticity/low thermal expansion semiconductor package substrate materials R-1515W

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1 Models of Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series High elasticity/low thermal expansion semiconductor package substrate materials R-1515W

Image Part Number Price (excluding tax) Glass transition temperature (Tg) °C Flexural modulus GPa Dielectric constant (Dk) Thermal decomposition temperature (Td) °C Thermal expansion coefficient (vertical/horizontal direction) ppm/℃ Thermal expansion coefficient (thickness direction) ppm/℃ Dissipation factor (Df)
Semiconductor device materials Substrate materials for semiconductor packages “LEXCM GX” series High elasticity/low thermal expansion semiconductor package substrate materials R-1515W-Part Number-R-1515W

R-1515W

Available upon quote

250

25℃: 35
250℃: 21

4.8

390

9

Α1:22
α2:97

0.015

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