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  4. Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion, high mounting reliability semiconductor package substrate materials (Panasonic Industry Co., Ltd.)
Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion, high mounting reliability semiconductor package substrate materials-R-1515V
Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion, high mounting reliability semiconductor package substrate materials-Panasonic Industry Co., Ltd.

Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion, high mounting reliability semiconductor package substrate materials
Panasonic Industry Co., Ltd.

About This Product

■Substrate material for semiconductor packages “LEXCM GX” series

Achieving thinner, smaller, and less warped semiconductor packages

■Low thermal expansion, high mounting reliability semiconductor package substrate material

・Low thermal expansion suppresses warpage and reduces defects in primary mounting of IC chips. ・Improves the reliability of secondary mounting using stress relaxation technology that combines the elasticity and cushioning properties of resin. ・Excellent plate thickness accuracy and stable bonding between substrate and IC chip.

■Applications

semiconductor package

■Detailed usage

Semiconductor package substrates (FC-BGA packages for CPU, GPU, FPGA, ASIC, etc.)

■Main characteristics

・CTE x,y-axis　3-5ppm/℃ (low thermal expansion glass cloth) ・Stress relaxation ・Excellent thickness uniformity

■A wide range of board thicknesses available

・R-1515V (low thermal expansion glass cloth): 0.21~1.8mm ・R-1515K (general glass cloth): 0.21~1.8mm

■High mounting reliability

・Low CTE <Primary mounting>: Low thermal expansion that approaches the coefficient of thermal expansion of IC chips, suppresses warping, and reduces defects in IC chip mounting (primary mounting). ・Stress relaxation <Secondary mounting>: While ensuring low thermal expansion, the reliability of secondary mounting is improved by stress relaxation technology that combines the stretchability and cushioning properties of resin.

  • Product

    Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion, high mounting reliability semiconductor package substrate materials

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1 Models of Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion, high mounting reliability semiconductor package substrate materials

Image Part Number Price (excluding tax) Glass transition temperature (Tg) °C Flexural modulus GPa Dielectric constant (Dk) Thermal expansion coefficient (vertical/horizontal direction) ppm/℃ Dissipation factor (Df)
Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion, high mounting reliability semiconductor package substrate materials-Part Number-R-1515V

R-1515V

Available upon quote

260

25℃: 30
250℃: 14

4.4

3-5

0.016

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