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  4. Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages High elasticity, low thermal expansion, and ultra-thin semiconductor package substrate materials (Panasonic Industry Co., Ltd.)
Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages High elasticity, low thermal expansion, and ultra-thin semiconductor package substrate materials-R-151YE
Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages High elasticity, low thermal expansion, and ultra-thin semiconductor package substrate materials-Panasonic Industry Co., Ltd.

Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages High elasticity, low thermal expansion, and ultra-thin semiconductor package substrate materials
Panasonic Industry Co., Ltd.

About This Product

■Substrate material for semiconductor packages “LEXCM GX” series

Achieving thinner, smaller, and less warped semiconductor packages

■High elasticity, low thermal expansion, ultra-thin semiconductor package substrate material

Ultra-thin materials allow for thinner semiconductor packages, and low thermal expansion reduces substrate warpage.

■Applications

semiconductor package substrate

■Detailed usage

CSP (DRAM, NAND/PMIC, Mini LED, etc.), FC-CSP (APU, RF-IC, etc.)

■Main characteristics

・Bending elastic modulus 25℃ 33GPa ・CTE x, y-axis 9ppm/℃ ・Tg (DMA) 270℃

  • Product

    Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages High elasticity, low thermal expansion, and ultra-thin semiconductor package substrate materials

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1 Models of Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages High elasticity, low thermal expansion, and ultra-thin semiconductor package substrate materials

Image Part Number Price (excluding tax) Glass transition temperature (Tg) °C Flexural modulus GPa Dielectric constant (Dk) Thermal decomposition temperature (Td) °C Thermal expansion coefficient (vertical/horizontal direction) ppm/℃ Thermal expansion coefficient (thickness direction) ppm/℃ Dissipation factor (Df)
Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages High elasticity, low thermal expansion, and ultra-thin semiconductor package substrate materials-Part Number-R-151YE

R-151YE

Available upon quote

270

25℃: 33
250℃: 18

4.7

390

9

Α1:22
α2:95

0.011

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