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  4. Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials (Panasonic Industry Co., Ltd.)
Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials-R-G515S
Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials-Panasonic Industry Co., Ltd.

Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials
Panasonic Industry Co., Ltd.

About This Product

■Substrate material for semiconductor packages “LEXCM GX” series

Achieving thinner, smaller, and less warped semiconductor packages

■Low thermal expansion/ultra-thin semiconductor package substrate material

・Ultra-thin substrate material that enables thinner semiconductor packages (insulating layer thickness of 15 μm or less) - Achieves excellent mounting reliability by suppressing warpage caused by differences in thermal expansion coefficients.

■Applications

semiconductor package

■Detailed usage

Semiconductor package substrate CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)

■Main characteristics

・CTE x,y-axis 4-6ppm/℃ (low thermal expansion glass cloth) ・Low warpage ・Excellent moldability of ultra-thin materials

■Package board warpage evaluation results

R-G515S (low thermal expansion glass cloth specification) achieves approximately half the warpage width compared to conventional materials.

■Melt viscosity behavior

R-G510 has a wider melting area and superior formability compared to conventional materials.

  • Product

    Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials

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1 Models of Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials

Image Part Number Price (excluding tax) Glass transition temperature (Tg) °C Flexural modulus GPa Dielectric constant (Dk) Thermal expansion coefficient (vertical/horizontal direction) ppm/℃ Dissipation factor (Df)
Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials-Part Number-R-G515S

R-G515S

Available upon quote

220-240

25℃: 28

4.2

4-6

0.008

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