Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials
Panasonic Industry Co., Ltd.

About This Product

■Substrate material for semiconductor packages “LEXCM GX” seriesAchieving thinner, smaller, and less warped semiconductor packages

■Low thermal expansion/ultra-thin semiconductor package substrate material・Ultra-thin substrate material that enables thinner semiconductor packages (insulating layer thickness of 15 μm or less)
- Achieves excellent mounting reliability by suppressing warpage caused by differences in thermal expansion coefficients.

■Applicationssemiconductor package

■Detailed usageSemiconductor package substrate CSP (PoP-Bottom, Flip-Chip, Memory, Module, etc.)

■Main characteristics・CTE x,y-axis 4-6ppm/℃ (low thermal expansion glass cloth)
・Low warpage
・Excellent moldability of ultra-thin materials

■Package board warpage evaluation resultsR-G515S (low thermal expansion glass cloth specification) achieves approximately half the warpage width compared to conventional materials.

■Melt viscosity behaviorR-G510 has a wider melting area and superior formability compared to conventional materials.

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Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials

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Panasonic Industry Co., Ltd.

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1 Models of Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials

Image	Part Number	Price (excluding tax)	Glass transition temperature (Tg) °C	Flexural modulus GPa	Dielectric constant (Dk)	Thermal expansion coefficient (vertical/horizontal direction) ppm/℃	Dissipation factor (Df)
	R-G515S	Available upon quote	220-240	25℃: 28	4.2	4-6	0.008

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Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials Panasonic Industry Co., Ltd.

About This Product

■Substrate material for semiconductor packages “LEXCM GX” series

■Low thermal expansion/ultra-thin semiconductor package substrate material

■Applications

■Detailed usage

■Main characteristics

■Package board warpage evaluation results

■Melt viscosity behavior

1 Models of Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials

R-G515S

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Other products of Panasonic Industry Co., Ltd.

About Company Handling This Product

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Semiconductor device materials "LEXCM GX" series of substrate materials for semiconductor packages Low thermal expansion and ultra-thin semiconductor package substrate materials
Panasonic Industry Co., Ltd.