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  4. Semiconductor device materials “LEXCM GX” series of substrate materials for semiconductor packages Ultra-low loss materials for semiconductor packages and module substrates (Panasonic Industry Co., Ltd.)
Semiconductor device materials “LEXCM GX” series of substrate materials for semiconductor packages Ultra-low loss materials for semiconductor packages and module substrates-R-G545L
Semiconductor device materials “LEXCM GX” series of substrate materials for semiconductor packages Ultra-low loss materials for semiconductor packages and module substrates-Panasonic Industry Co., Ltd.

Semiconductor device materials “LEXCM GX” series of substrate materials for semiconductor packages Ultra-low loss materials for semiconductor packages and module substrates
Panasonic Industry Co., Ltd.

About This Product

■Substrate material for semiconductor packages “LEXCM GX” series

Achieving thinner, smaller, and less warped semiconductor packages

■Ultra-low loss materials for semiconductor packages and module substrates

- Contributes to the evolution of devices by achieving both the industry's highest level of low Dk/Df and low CTE. ・Characteristics are stable even in high frequency bands and high temperature and high humidity environments.

■Applications

semiconductor package

■Detailed usage

Semiconductor package substrates for base stations, module parts, etc.

■Main characteristics

・Dk 3.5 Df 0.003@12GHz ・CTE x, y-axis 10ppm/℃ CTE z-axis 22ppm/℃ ・Tg (DMA) 230℃

  • Product

    Semiconductor device materials “LEXCM GX” series of substrate materials for semiconductor packages Ultra-low loss materials for semiconductor packages and module substrates

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1 Models of Semiconductor device materials “LEXCM GX” series of substrate materials for semiconductor packages Ultra-low loss materials for semiconductor packages and module substrates

Image Part Number Price (excluding tax) Glass transition temperature (Tg) °C Water absorption rate % Flexural modulus GPa Dielectric constant (Dk) Thermal expansion coefficient (vertical/horizontal direction) ppm/℃ Thermal expansion coefficient (thickness direction) ppm/℃ Dissipation factor (Df)
Semiconductor device materials “LEXCM GX” series of substrate materials for semiconductor packages Ultra-low loss materials for semiconductor packages and module substrates-Part Number-R-G545L

R-G545L

Available upon quote

230

0.06

25℃: 23
250℃: 10

3.5

10

Twenty two

0.003

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