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  4. Glass composite board material Thick copper foil glass composite board material R-1786 (Panasonic Industry Co., Ltd.)
Glass composite board material Thick copper foil glass composite board material R-1786-R-1786 Thick copper foil glass composite board material
Glass composite board material Thick copper foil glass composite board material R-1786-Panasonic Industry Co., Ltd.

Glass composite board material Thick copper foil glass composite board material R-1786
Panasonic Industry Co., Ltd.

About This Product

■Glass composite substrate material

・A board material that achieves the industry's highest level of safety and security performance and excellent cost performance through size-free construction methods. ・Excellent tracking resistance (CTI600)

■Thick copper foil glass composite board material

・Suitable for large current applications due to the use of thick copper foil (copper foil 70μm) ・Highly reliable CEM-3 grade material (tracking resistance: CTI600)

■Applications

For high current applications

■Detailed usage

Power supply board, inverter, converter board Example: Solar power generation power conditioner, storage battery

■Main characteristics

・Supports large current (thick copper foil type) ・Tracking resistance ・High reliability

  • Product

    Glass composite board material Thick copper foil glass composite board material R-1786

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1 Models of Glass composite board material Thick copper foil glass composite board material R-1786

Image Part Number Price (excluding tax) Solder heat resistance Glass transition temperature (Tg) (℃) Volume resistivity MΩ･m Water absorption rate % Bending strength N/mm² Dielectric constant (Dk) 1GHz Relative permittivity (Dk) 1MHz Thermal expansion coefficient (vertical direction) ppm/℃ Thermal expansion coefficient (horizontal direction) ppm/℃ Thermal expansion coefficient (thickness direction) ppm/℃ Insulation resistance MΩ Alkali resistance Heat resistance Flame resistance Surface resistance MΩ Dissipation factor (Df) 1GHz Dissipation factor (Df) 1MHz Copper foil peel strength N/mm
Glass composite board material Thick copper foil glass composite board material R-1786-Part Number-R-1786 Thick copper foil glass composite board material

R-1786 Thick copper foil glass composite board material

Available upon quote

No abnormalities

140

C-96/20/65: 1x108
C-96/20/65+C-96/40/90: 5x107

0.08

280

4

4.2

25 (20)

28 (23)

65

C-96/20/65: 5x108
C-96/20/65+D-2/100: 1x107

No abnormalities

240℃ 60 minutes

94V-0

C-96/20/65: 3x108
C-96/20/65+C-96/40/90: 1x108

0.007

0.011

A: 2.2
Solder float 260℃ 20 seconds: 2.1

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About Company Handling This Product

Panasonic Industry Co., Ltd.

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