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Glass composite substrate materialHandling Company
Panasonic Industry Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | Solder heat resistance | Glass transition temperature (Tg) (℃) | Volume resistivity MΩ・m | Water absorption rate % | Bending strength N/mm² | Dielectric constant (Dk) 1GHz | Relative permittivity (Dk) 1MHz | Thermal expansion coefficient (vertical direction) ppm/℃ | Thermal expansion coefficient (horizontal direction) ppm/℃ | Thermal expansion coefficient (thickness direction) ppm/℃ | Insulation resistance MΩ | Alkali resistance | Heat resistance | Flame resistance | Surface resistance MΩ | Dissipation factor (Df) 1GHz | Dissipation factor (Df) 1MHz | Copper foil peel strength N/mm |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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R-1786 Glass composite substrate material |
Available upon quote |
No abnormalities |
140 |
C-96/20/65: 1x108 |
0.08 |
280 |
4.2 |
4.2 |
25 (20) |
28 (23) |
65 |
C-96/20/65: 5x108 |
No abnormalities |
240℃ 60 minutes |
94V-0 |
C-96/20/65: 3x108 |
0.007 |
0.011 |
Copper foil: 0.018mm (18µm): 1.37 |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.