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Halogen-free glass epoxy multilayer board material "Halogen-free" series R-3566DHandling Company
Panasonic Industry Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | PLC | RTI ℃ | T288 (with copper) min | Glass transition temperature (Tg) °C | Thermal decomposition temperature (Td) °C | Thermal expansion coefficient (thickness direction) α1 ppm/℃ | Thermal expansion coefficient (thickness direction) α2 ppm/℃ | Flame resistance | Copper foil peel strength kN/m |
---|---|---|---|---|---|---|---|---|---|---|---|
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R-3566D |
Available upon quote |
0 |
150 |
10 |
DSC 175 |
355 |
40 |
180 |
94V-0 |
1.6 |
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Reviews shown here are reviews of companies.