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Halogen-free glass epoxy multilayer board material "Halogen-free" seriesHandling Company
Panasonic Industry Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | T288 (with copper) min | Glass transition temperature (Tg) °C | Thermal decomposition temperature (Td) °C | Thermal expansion coefficient (thickness direction) α1 ppm/℃ | Thermal expansion coefficient (thickness direction) α2 ppm/℃ | Tracking resistance V | Copper foil peel strength kN/m |
---|---|---|---|---|---|---|---|---|---|
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R-1566 |
Available upon quote |
3 |
148 |
350 |
40 |
180 |
600>CTI≧400 |
1.8 |
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Reviews shown here are reviews of companies.