Electronic circuit board materials Flexible board materials for mobile devices “FELIOS” series FELIOS FRCC-R-FR10

Electronic circuit board materials Flexible board materials for mobile devices “FELIOS” series FELIOS FRCC
Panasonic Industry Co., Ltd.

About This Product

■Flexible substrate material “FELIOS” series for mobile devicesFlexible substrate materials that meet the various mounting needs of mobile devices such as smartphones and digital home appliances. In addition to excellent dimensional stability, we have a lineup of products that also have springback properties and high frequency characteristics.

■Flexible board material Resin coated copper foil FELIOS FRCC- Enables thinner, multi-layer construction and simplification of the build-up process, contributing to thinner and smaller mobile devices and modules.
・Achieves a 3-layer flexible circuit board with excellent moldability and a smoother surface layer

■Applicationsmobile

■Detailed usageSmartphones (main board, sub board, module board), etc.

■Main characteristics・Thin and multi-layered
・Simplification of build-up process
・Excellent surface smoothness

■ConceptThe manufacturing process can be simplified because the board can be made thin and multi-layered.

■Thin and multi-layeredRigid-flex can be made thinner

■Surface smoothnessSurface smoothness after molding

Model
There is 1 model available for this product.

Product
Electronic circuit board materials Flexible board materials for mobile devices “FELIOS” series FELIOS FRCC

Handling Company
Panasonic Industry Co., Ltd.

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Boards & Circuit Boards

Printed Circuit Boards

Boards & Circuit Boards

FPCs

Boards & Circuit Boards

Flexible Printed Circuit Boards (PCB)

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1 Models of Electronic circuit board materials Flexible board materials for mobile devices “FELIOS” series FELIOS FRCC

Image	Part Number	Price (excluding tax)	Solder heat resistance	Glass transition temperature (Tg) In-house method (DMA) °C	Glass transition temperature (Tg) In-house method (TMA) °C	Volume resistivity MΩ m	Water absorption rate %	Peel strength N/mm	Elastic modulus GPa	Dielectric constant (Dk) 1GHz	Dielectric constant (Dk) 2GHz	Thermal expansion coefficient (vertical/horizontal direction) α1 ppm/℃	Thermal expansion coefficient (vertical/horizontal direction) α2 ppm/℃	Thermal expansion coefficient (thickness direction) α1 ppm/℃	Thermal expansion coefficient (thickness direction) α2 ppm/℃	Alkali resistance	Folding resistance times	Flame resistance	Surface resistance MΩ·m	Dissipation factor (Df) 1GHz	Dissipation factor (Df) 2GHz
	R-FR10	Available upon quote	No abnormalities	70,210 (Ad) / 320 (PI)	190 (AD) / 270 (PI)	C-96/20/65 1×108 C-96/20/65+C-96/40/90 9×107	1.2	0.8	1.0 (AD) /4.0 (PI)	3.0 (AD) / 3.3 (PI)	3.0 (AD) / 3.2 (PI)	80 (AD) / 25 (PI)	580 (Ad) / 25 (PI)	210 (Ad) / - (PI)	210 (Ad) / - (PI)	No abnormalities	>150	94VTM-0	C-96/20/65 3×108 C-96/20/65+C-96/40/90 1×108	0.019 (Ad) / 0.010 (PI)	0.020 (AD) / 0.010 (PI)

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About Company Handling This Product

Panasonic Industry Co., Ltd.

Electronic circuit board materials Flexible board materials for mobile devices “FELIOS” series FELIOS FRCC Panasonic Industry Co., Ltd.

About This Product

■Flexible substrate material “FELIOS” series for mobile devices

■Flexible board material Resin coated copper foil FELIOS FRCC

■Applications

■Detailed usage

■Main characteristics

■Concept

■Thin and multi-layered

■Surface smoothness

1 Models of Electronic circuit board materials Flexible board materials for mobile devices “FELIOS” series FELIOS FRCC

R-FR10

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Electronic circuit board materials Flexible board materials for mobile devices “FELIOS” series FELIOS FRCC
Panasonic Industry Co., Ltd.