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  4. Electronic circuit board material Flexible board material for mobile devices "FELIOS" series FELIOS R-BM17 (Panasonic Industry Co., Ltd.)
Electronic circuit board material Flexible board material for mobile devices "FELIOS" series FELIOS R-BM17-R-BM17
Electronic circuit board material Flexible board material for mobile devices "FELIOS" series FELIOS R-BM17-Panasonic Industry Co., Ltd.

Electronic circuit board material Flexible board material for mobile devices "FELIOS" series FELIOS R-BM17
Panasonic Industry Co., Ltd.

About This Product

■Flexible substrate material “FELIOS” series for mobile devices

Flexible substrate materials that meet the various mounting needs of mobile devices such as smartphones and digital home appliances. In addition to excellent dimensional stability, we have a lineup of products that also have springback properties and high frequency characteristics.

■Low transmission loss flexible multilayer board material

・Multi-layered LCP contributes to thinner devices ・Improved handling of bonding sheet ・Contributes to higher speed/lower loss of FPC cables

■Applications

mobile

■Detailed usage

Antenna modules for mobile devices (smartphones, tablet PCs, etc.), etc.

■Main characteristics

・Contributes to making devices thinner (coaxial cable replacement/multilayer possible) ・Improved handling during machining ・Contributes to higher speed/lower loss of FPC cables

  • Product

    Electronic circuit board material Flexible board material for mobile devices "FELIOS" series FELIOS R-BM17

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1 Models of Electronic circuit board material Flexible board material for mobile devices "FELIOS" series FELIOS R-BM17

Image Part Number Price (excluding tax) Seam foldability Inner circuit Number Seam foldability Outer circuit Number Soldering heat resistance A ℃ Soldering heat resistance C96/40/90℃ Relative permittivity (Dk) A Specific permittivity (Dk) C96/40/90 Folding durability MIT test Number Flame resistance Dissipation factor (Df) A Dissipation factor (Df) C96/40/90 Copper foil peel strength N/mm
Electronic circuit board material Flexible board material for mobile devices "FELIOS" series FELIOS R-BM17-Part Number-R-BM17

R-BM17

Available upon quote

11

19

270 Pass between LCP and bonding sheet
270 Pass between copper foil and bonding sheet

260 Pass between LCP and bonding sheet
260 Pass between copper foil and bonding sheet

2.85

2.84

55

94VTM-0

0.0021

0.0021

Between LCP and bonding sheet 1.08
Between copper foil and bonding sheet 0.73

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