Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S-R-F705S

Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S
Panasonic Industry Co., Ltd.

About This Product

■Flexible substrate material “FELIOS” series for mobile devicesFlexible substrate materials that meet the various mounting needs of mobile devices such as smartphones and digital home appliances. In addition to excellent dimensional stability, we have a lineup of products that also have springback properties and high frequency characteristics.

■Flexible substrate material LCP (liquid crystal polymer) FELIOS LCP- Due to its excellent high frequency characteristics, it contributes to high-capacity, high-speed transmission in mobile devices and can replace coaxial cables.
・It has excellent dielectric properties when absorbing moisture, and is compatible with millimeter wave radar antenna substrates that require water resistance and environmental resistance.

■Applications・Aerospace
・Wireless communication
·antenna

■Detailed usageAerospace equipment, smartphones (antenna modules), notebook PCs, tablet PCs, 4K/8K displays (high-speed FPC cables), in-vehicle equipment (millimeter wave radar), etc.

■Main characteristics・Dk 2.9 Df 0.002@14GHz
・Water absorption rate 0.04%
・Copper foil peeling strength 0.8N/mm

■LineupCompatible with thick plate specifications with high plate thickness accuracy

■ConceptContributes to smaller and lighter equipment by being thinner than coaxial cables

■Dielectric properties during moisture absorptionR-F705S has lower transmission loss than polyimide products even when absorbing moisture

Model
There is 1 model available for this product.

Product
Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S

Handling Company
Panasonic Industry Co., Ltd.

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Boards & Circuit Boards

Printed Circuit Boards

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1 Models of Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S

Image	Part Number	Price (excluding tax)	Solder heat resistance	Outgas TML/CVCM / WVR %	Water absorption rate %	Moisture absorption solder heat resistance	Dimensional stability After E-0.5/150 MD direction %	Dimensional stability After E-0.5/150 TD direction %	Dimensional stability After etching MD direction %	Dimensional stability After etching TD direction %	Elastic modulus GPa	Dielectric constant (Dk) 10GHz	Dielectric constant (Dk) 14GHz	Flame resistance	Chemical resistance	Insulation resistance of surface layer MΩ	Dissipation factor (Df) 10GHz	Dissipation factor (Df) 14GHz	Copper foil peel strength ED: 18μm N/mm
	R-F705S	Available upon quote	No abnormalities	0.05/<0.01/0.04	0.04	No abnormalities	0.052	0.035	0.008	0.007	3.5	3.3	2.9	94VTM-0	No abnormalities	4.0x1010	0.002	0.002	0.8

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About Company Handling This Product

Panasonic Industry Co., Ltd.

Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S Panasonic Industry Co., Ltd.

About This Product

■Flexible substrate material “FELIOS” series for mobile devices

■Flexible substrate material LCP (liquid crystal polymer) FELIOS LCP

■Applications

■Detailed usage

■Main characteristics

■Lineup

■Concept

■Dielectric properties during moisture absorption

1 Models of Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S

R-F705S

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Other products of Panasonic Industry Co., Ltd.

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Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S
Panasonic Industry Co., Ltd.