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  4. Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S (Panasonic Industry Co., Ltd.)
Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S-R-F705S
Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S-Panasonic Industry Co., Ltd.

Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S
Panasonic Industry Co., Ltd.

About This Product

■Flexible substrate material “FELIOS” series for mobile devices

Flexible substrate materials that meet the various mounting needs of mobile devices such as smartphones and digital home appliances. In addition to excellent dimensional stability, we have a lineup of products that also have springback properties and high frequency characteristics.

■Flexible substrate material LCP (liquid crystal polymer) FELIOS LCP

- Due to its excellent high frequency characteristics, it contributes to high-capacity, high-speed transmission in mobile devices and can replace coaxial cables. ・It has excellent dielectric properties when absorbing moisture, and is compatible with millimeter wave radar antenna substrates that require water resistance and environmental resistance.

■Applications

・Aerospace ・Wireless communication ·antenna

■Detailed usage

Aerospace equipment, smartphones (antenna modules), notebook PCs, tablet PCs, 4K/8K displays (high-speed FPC cables), in-vehicle equipment (millimeter wave radar), etc.

■Main characteristics

・Dk 2.9 Df 0.002@14GHz ・Water absorption rate 0.04% ・Copper foil peeling strength 0.8N/mm

■Lineup

Compatible with thick plate specifications with high plate thickness accuracy

■Concept

Contributes to smaller and lighter equipment by being thinner than coaxial cables

■Dielectric properties during moisture absorption

R-F705S has lower transmission loss than polyimide products even when absorbing moisture

  • Product

    Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S

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1 Models of Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S

Image Part Number Price (excluding tax) Solder heat resistance Outgas TML/CVCM / WVR % Water absorption rate % Moisture absorption solder heat resistance Dimensional stability After E-0.5/150 MD direction % Dimensional stability After E-0.5/150 TD direction % Dimensional stability After etching MD direction % Dimensional stability After etching TD direction % Elastic modulus GPa Dielectric constant (Dk) 10GHz Dielectric constant (Dk) 14GHz Flame resistance Chemical resistance Insulation resistance of surface layer MΩ Dissipation factor (Df) 10GHz Dissipation factor (Df) 14GHz Copper foil peel strength ED: 18μm N/mm
Electronic circuit board materials Flexible board materials for mobile devices "FELIOS" series FELIOS LCP R-F705S-Part Number-R-F705S

R-F705S

Available upon quote

No abnormalities

0.05/<0.01/0.04

0.04

No abnormalities

0.052

0.035

0.008

0.007

3.5

3.3

2.9

94VTM-0

No abnormalities

4.0x1010

0.002

0.002

0.8

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