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  4. Electronic circuit board material Flexible board material for mobile devices "FELIOS" series R-F775 (Panasonic Industry Co., Ltd.)
Electronic circuit board material Flexible board material for mobile devices "FELIOS" series R-F775-R-F775
Electronic circuit board material Flexible board material for mobile devices "FELIOS" series R-F775-Panasonic Industry Co., Ltd.

Electronic circuit board material Flexible board material for mobile devices "FELIOS" series R-F775
Panasonic Industry Co., Ltd.

About This Product

■Flexible substrate material “FELIOS” series for mobile devices

Flexible substrate materials that meet the various mounting needs of mobile devices such as smartphones and digital home appliances. In addition to excellent dimensional stability, we have a lineup of products that also have springback properties and high frequency characteristics.

■Flexible substrate material FELIOS

・With a variety of thicknesses available, it can be applied to a variety of applications including mobile devices. ・Excellent heat resistance, dimensional stability, and quality. ・Suitable for aerospace applications due to low outgas. (ASTM E-595 compliant)

■Applications

・Aerospace ・Industry ・Automotive

■Detailed usage

Mobile devices (smartphones, tablet PCs), medical equipment, industrial equipment, aviation equipment, automotive cables (wire harness replacement), etc.

■Main characteristics

・High heat resistance MOT 160℃ ・Wide range of film thickness and copper foil thickness lineup ・Excellent dimensional stability

■Lineup

We can accommodate various film and copper foil combinations. Roll cut type: Max.610mm (MD) x500mm (TD) / Roll type: W=250mm,500mm

  • Product

    Electronic circuit board material Flexible board material for mobile devices "FELIOS" series R-F775

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1 Models of Electronic circuit board material Flexible board material for mobile devices "FELIOS" series R-F775

Image Part Number Price (excluding tax) Soldering heat resistance A ℃ Soldering heat resistance C-96/40/90 ℃ Outgas TML/CVCM / WVR % Water absorption rate % Dimensional stability After etching MD direction % Dimensional stability After etching TD direction % Tensile strength MPa Elastic modulus GPa Dielectric constant (Dk) Thermal conductivity W/m･K Thermal expansion coefficient MD/TD ppm/℃ Thermal expansion coefficient in thickness direction ppm/℃ Flame resistance Dissipation factor (Df) Copper foil peel strength N/mm
Electronic circuit board material Flexible board material for mobile devices "FELIOS" series R-F775-Part Number-R-F775

R-F775

Available upon quote

>330

260

0.62 / 0.05 / 0.55

0.9

0.00±0.10

0.00±0.10

542

7.1

3.2

0.16

17/19

101

94V-0

0.003

1.35

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