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  4. Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755E (Panasonic Industry Co., Ltd.)
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755E-R-1755E
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755E-Panasonic Industry Co., Ltd.

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755E
Panasonic Industry Co., Ltd.

About This Product

■Multilayer substrate material “HIPER” series for in-vehicle equipment

・Multilayer board material with excellent reliability and high heat resistance ・Excellent CAF resistance and through-hole continuity reliability even under harsh usage environments, and good board processability.

■High heat resistance and low thermal expansion multilayer board material HIPER E

・Material with excellent heat resistance despite being a general-purpose material ・Applicable to automotive applications in high-temperature environments, high voltage applications, industrial equipment applications, etc.

■Applications

・Automotive ・Industry

■Detailed usage

In-vehicle equipment (engine ECU, car navigation system), electric vehicles, industrial equipment, appliances, etc.

■Main characteristics

・Tg (DSC) 133℃ ・Td (TGA) 370℃ ・CTE z-axis 42ppm/℃

  • Product

    Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755E

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1 Models of Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755E

Image Part Number Price (excluding tax) T288 (with copper) min Glass transition temperature (Tg) °C Water absorption rate % Bending modulus of elasticity Vertical direction GPa Bending elastic modulus Horizontal direction GPa Dielectric constant (Dk) Thermal decomposition temperature (Td) °C Thermal expansion coefficient (vertical direction) α1 ppm/℃ Thermal expansion coefficient (horizontal direction) α1 ppm/℃ Thermal expansion coefficient (thickness direction) α1 ppm/℃ Thermal expansion coefficient (thickness direction) α2 ppm/℃ Flame resistance Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755E-Part Number-R-1755E

R-1755E

Available upon quote

Twenty five

133

0.11

Twenty four

Twenty two

4.6

370

11-13

13-15

42

250

94V-0

0.013

1.6

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