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  4. Electronic circuit board material Multilayer board material for automotive equipment “HIPER” series R-1755M (Panasonic Industry Co., Ltd.)
Electronic circuit board material Multilayer board material for automotive equipment “HIPER” series R-1755M-R-1755M
Electronic circuit board material Multilayer board material for automotive equipment “HIPER” series R-1755M-Panasonic Industry Co., Ltd.

Electronic circuit board material Multilayer board material for automotive equipment “HIPER” series R-1755M
Panasonic Industry Co., Ltd.

About This Product

■Multilayer substrate material “HIPER” series for in-vehicle equipment

・Multilayer board material with excellent reliability and high heat resistance ・Excellent CAF resistance and through-hole continuity reliability even under harsh usage environments, and good board processability.

■High heat resistance/low thermal expansion multilayer board material <Middle-Tg type> HIPER M

・Excellent CAF resistance improves connection reliability of automotive boards and contributes to further vehicle safety ・Suitable for high voltage applications, industrial equipment applications, etc.

■Applications

・Automotive ・Industry

■Detailed usage

Automotive equipment (ECU boards), solar power generation, electronic equipment that requires high reliability (using lead-free solder), etc.

■Main characteristics

・Tg (DSC) 153℃ ・Td (TGA) 355℃ ・CTE z-axis 40ppm/℃

  • Product

    Electronic circuit board material Multilayer board material for automotive equipment “HIPER” series R-1755M

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1 Models of Electronic circuit board material Multilayer board material for automotive equipment “HIPER” series R-1755M

Image Part Number Price (excluding tax) T288 (with copper) min Glass transition temperature (Tg) °C Water absorption rate % Bending modulus of elasticity Vertical direction GPa Bending elastic modulus Horizontal direction GPa Dielectric constant (Dk) Thermal decomposition temperature (Td) °C Thermal expansion coefficient (vertical direction) α1 ppm/℃ Thermal expansion coefficient (horizontal direction) α1 ppm/℃ Thermal expansion coefficient (thickness direction) α1 ppm/℃ Thermal expansion coefficient (thickness direction) α2 ppm/℃ Flame resistance Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board material Multilayer board material for automotive equipment “HIPER” series R-1755M-Part Number-R-1755M

R-1755M

Available upon quote

18

153

0.11

Twenty four

Twenty two

4.6

355

11-13

13-15

40

240

94V-0

0.014

1.5

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