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Electronic circuit board material Multilayer board material for automotive equipment “HIPER” series R-1755MHandling Company
Panasonic Industry Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | T288 (with copper) min | Glass transition temperature (Tg) °C | Water absorption rate % | Bending modulus of elasticity Vertical direction GPa | Bending elastic modulus Horizontal direction GPa | Dielectric constant (Dk) | Thermal decomposition temperature (Td) °C | Thermal expansion coefficient (vertical direction) α1 ppm/℃ | Thermal expansion coefficient (horizontal direction) α1 ppm/℃ | Thermal expansion coefficient (thickness direction) α1 ppm/℃ | Thermal expansion coefficient (thickness direction) α2 ppm/℃ | Flame resistance | Dissipation factor (Df) | Copper foil peel strength kN/m |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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R-1755M |
Available upon quote |
18 |
153 |
0.11 |
Twenty four |
Twenty two |
4.6 |
355 |
11-13 |
13-15 |
40 |
240 |
94V-0 |
0.014 |
1.5 |
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Reviews shown here are reviews of companies.