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Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755DHandling Company
Panasonic Industry Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | T288 (with copper) min | Glass transition temperature (Tg) °C | Water absorption rate % | Bending modulus of elasticity Vertical direction GPa | Bending elastic modulus Horizontal direction GPa | Dielectric constant (Dk) | Thermal decomposition temperature (Td) °C | Thermal expansion coefficient (vertical direction) α1 ppm/℃ | Thermal expansion coefficient (horizontal direction) α1 ppm/℃ | Thermal expansion coefficient (thickness direction) α1 ppm/℃ | Thermal expansion coefficient (thickness direction) α2 ppm/℃ | Flame resistance | Dissipation factor (Df) | Copper foil peel strength kN/m |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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R-1755D |
Available upon quote |
15 |
163 |
0.11 |
Twenty three |
Twenty one |
4.4 |
345 |
10-12 |
12-14 |
43 |
236 |
94V-0 |
0.016 |
1.3 |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.