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  4. Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D (Panasonic Industry Co., Ltd.)
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D-R-1755D
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D-Panasonic Industry Co., Ltd.

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D
Panasonic Industry Co., Ltd.

About This Product

■Multilayer substrate material “HIPER” series for in-vehicle equipment

・Multilayer board material with excellent reliability and high heat resistance ・Excellent CAF resistance and through-hole continuity reliability even under harsh usage environments, and good board processability.

■High heat resistance and low thermal expansion multilayer board material <High-Tg type> HIPER D

・Excellent connection reliability even in low and high temperature temperature cycles, improving solder connection reliability ・Excellent insulation reliability, applicable to high voltage applications

■Applications

automotive

■Detailed usage

In-vehicle ECU, etc.

■Main characteristics

・Tg (DSC) 163℃ ・Td (TGA) 345℃ ・CTE x-axis 10-12ppm/℃

  • Product

    Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D

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1 Models of Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D

Image Part Number Price (excluding tax) T288 (with copper) min Glass transition temperature (Tg) °C Water absorption rate % Bending modulus of elasticity Vertical direction GPa Bending elastic modulus Horizontal direction GPa Dielectric constant (Dk) Thermal decomposition temperature (Td) °C Thermal expansion coefficient (vertical direction) α1 ppm/℃ Thermal expansion coefficient (horizontal direction) α1 ppm/℃ Thermal expansion coefficient (thickness direction) α1 ppm/℃ Thermal expansion coefficient (thickness direction) α2 ppm/℃ Flame resistance Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D-Part Number-R-1755D

R-1755D

Available upon quote

15

163

0.11

Twenty three

Twenty one

4.4

345

10-12

12-14

43

236

94V-0

0.016

1.3

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