All Categories

History

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D-R-1755D
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D-Panasonic Industry Co., Ltd.

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D
Panasonic Industry Co., Ltd.


About This Product

■Multilayer substrate material “HIPER” series for in-vehicle equipment

・Multilayer board material with excellent reliability and high heat resistance ・Excellent CAF resistance and through-hole continuity reliability even under harsh usage environments, and good board processability.

■High heat resistance and low thermal expansion multilayer board material <High-Tg type> HIPER D

・Excellent connection reliability even in low and high temperature temperature cycles, improving solder connection reliability ・Excellent insulation reliability, applicable to high voltage applications

■Applications

automotive

■Detailed usage

In-vehicle ECU, etc.

■Main characteristics

・Tg (DSC) 163℃ ・Td (TGA) 345℃ ・CTE x-axis 10-12ppm/℃

  • Product

    Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D

Share this product


20+ people viewing


Free
Get started with our free quotation service - no cost, no obligation.

No Phone Required
We respect your privacy. You can receive quotes without sharing your phone number.

1 Models of Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D

Image Part Number Price (excluding tax) T288 (with copper) min Glass transition temperature (Tg) °C Water absorption rate % Bending modulus of elasticity Vertical direction GPa Bending elastic modulus Horizontal direction GPa Dielectric constant (Dk) Thermal decomposition temperature (Td) °C Thermal expansion coefficient (vertical direction) α1 ppm/℃ Thermal expansion coefficient (horizontal direction) α1 ppm/℃ Thermal expansion coefficient (thickness direction) α1 ppm/℃ Thermal expansion coefficient (thickness direction) α2 ppm/℃ Flame resistance Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755D-Part Number-R-1755D

R-1755D

Available upon quote

15

163

0.11

Twenty three

Twenty one

4.4

345

10-12

12-14

43

236

94V-0

0.016

1.3

Customers who viewed this product also viewed

Reviews shown here are reviews of companies.

See More Printed Circuit Boards Products

Other products of Panasonic Industry Co., Ltd.

Reviews shown here are reviews of companies.


View more products of Panasonic Industry Co., Ltd.

About Company Handling This Product

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2025 Metoree