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  4. Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755V (Panasonic Industry Co., Ltd.)
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755V-R-1755V
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755V-Panasonic Industry Co., Ltd.

Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755V
Panasonic Industry Co., Ltd.

About This Product

■Multilayer substrate material “HIPER” series for in-vehicle equipment

・Multilayer board material with excellent reliability and high heat resistance ・Excellent CAF resistance and through-hole continuity reliability even under harsh usage environments, and good board processability.

■High heat resistance and low thermal expansion multilayer board material <High-Tg type> HIPER V

Has transmission loss in the standard range and can be hybridized with the MEGTRON series.

■Applications

network

■Detailed usage

ICT infrastructure equipment, measuring equipment, etc.

■Main characteristics

・Dk 4.4 Df 0.016@1GHz ・Tg (DSC) 173℃ ・T288 (with copper) 20 minutes

  • Product

    Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755V

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1 Models of Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755V

Image Part Number Price (excluding tax) T288 (with copper) min Glass transition temperature (Tg) (℃) Dielectric constant (Dk) Thermal expansion coefficient in thickness direction α1 ppm/℃ Thermal expansion coefficient in thickness direction α2 ppm/℃ Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755V-Part Number-R-1755V

R-1755V

Available upon quote

20

173

4.4

44

255

0.016

1.5

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