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Electronic circuit board material Multilayer board material for automotive equipment "HIPER" series R-1755VHandling Company
Panasonic Industry Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | T288 (with copper) min | Glass transition temperature (Tg) (℃) | Dielectric constant (Dk) | Thermal expansion coefficient in thickness direction α1 ppm/℃ | Thermal expansion coefficient in thickness direction α2 ppm/℃ | Dissipation factor (Df) | Copper foil peel strength kN/m |
---|---|---|---|---|---|---|---|---|---|
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R-1755V |
Available upon quote |
20 |
173 |
4.4 |
44 |
255 |
0.016 |
1.5 |
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Reviews shown here are reviews of companies.