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  4. Electronic circuit board materials High frequency board materials for wireless communication equipment "XPEDION" series XPEDION T1 (Panasonic Industry Co., Ltd.)
Electronic circuit board materials High frequency board materials for wireless communication equipment "XPEDION" series XPEDION T1-R-5575X
Electronic circuit board materials High frequency board materials for wireless communication equipment "XPEDION" series XPEDION T1-Panasonic Industry Co., Ltd.

Electronic circuit board materials High frequency board materials for wireless communication equipment "XPEDION" series XPEDION T1
Panasonic Industry Co., Ltd.

About This Product

■High-frequency board material “XPEDION” series for wireless communication equipment

Achieves low transmission loss in high frequency range

■High thermal conductivity and low transmission loss halogen-free multilayer board material XPEDION T1

Combining halogen-free, low transmission loss, and high thermal conductivity, its multilayer moldability contributes to the downsizing and stable operation of base stations in 5G.

■Applications

・Wireless communication ・Automotive

■Detailed usage

Power amplifier boards (wireless communication base stations, small cells), antennas (vehicle millimeter wave radar, base stations), etc.

■Main characteristics

・Dk 3.60 Df 0.0045@13GHz ・Thermal conductivity 0.60W/m·K ・Tg (DMA) 245℃

  • Product

    Electronic circuit board materials High frequency board materials for wireless communication equipment "XPEDION" series XPEDION T1

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1 Models of Electronic circuit board materials High frequency board materials for wireless communication equipment "XPEDION" series XPEDION T1

Image Part Number Price (excluding tax) T288 (with copper) min Glass transition temperature (Tg) (℃) Dielectric constant (Dk) Thermal conductivity W/m·K Thermal expansion coefficient in thickness direction α1 ppm/℃ Thermal expansion coefficient in thickness direction α2 ppm/℃ Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board materials High frequency board materials for wireless communication equipment "XPEDION" series XPEDION T1-Part Number-R-5575X

R-5575X

Available upon quote

>120

TMA: 205
DMA: 245

3.6

0.6

20

155

0.0045

0.8

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