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  4. Electronic circuit board material High frequency board material for wireless communication equipment "XPEDION" series Halogen-free ultra-low transmission loss multilayer board material XPEDION1 (Panasonic Industry Co., Ltd.)
Electronic circuit board material High frequency board material for wireless communication equipment "XPEDION" series Halogen-free ultra-low transmission loss multilayer board material XPEDION1-R-5515X
Electronic circuit board material High frequency board material for wireless communication equipment "XPEDION" series Halogen-free ultra-low transmission loss multilayer board material XPEDION1-Panasonic Industry Co., Ltd.

Electronic circuit board material High frequency board material for wireless communication equipment "XPEDION" series Halogen-free ultra-low transmission loss multilayer board material XPEDION1
Panasonic Industry Co., Ltd.

About This Product

■High-frequency board material “XPEDION” series for wireless communication equipment

Achieves low transmission loss in high frequency range

■Halogen-free ultra-low transmission loss multilayer board material XPEDION1

・Prepreg contributes to multilayering of antenna layers and increased design freedom of high-frequency substrates. ・Contributes to higher gain of high-frequency antenna signals and lower substrate processing costs

■Applications

・Wireless communication ・Automotive

■Detailed usage

Antenna (vehicle millimeter wave radar, base station), etc.

■Main characteristics

・Dk 3.06 Df 0.0021@14GHz ・Tg (DMA) 200℃ ・Reduced substrate processing costs (vs. PTFE material)

  • Product

    Electronic circuit board material High frequency board material for wireless communication equipment "XPEDION" series Halogen-free ultra-low transmission loss multilayer board material XPEDION1

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1 Models of Electronic circuit board material High frequency board material for wireless communication equipment "XPEDION" series Halogen-free ultra-low transmission loss multilayer board material XPEDION1

Image Part Number Price (excluding tax) T288 (with copper) min Glass transition temperature (Tg) (℃) Dielectric constant (Dk) Thermal expansion coefficient in thickness direction α1 ppm/℃ Thermal expansion coefficient in thickness direction α2 ppm/℃ Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board material High frequency board material for wireless communication equipment "XPEDION" series Halogen-free ultra-low transmission loss multilayer board material XPEDION1-Part Number-R-5515X

R-5515X

Available upon quote

>120

200

3.06

50

300

0.0021

0.6

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