All Categories
History
Product
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON M R-5735Handling Company
Panasonic Industry Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | T288 (with copper) min | Glass transition temperature (Tg) (℃) | Dielectric constant (Dk) | Thermal expansion coefficient in thickness direction α1 ppm/℃ | Thermal expansion coefficient in thickness direction α2 ppm/℃ | Dissipation factor (Df) | Copper foil peel strength kN/m |
---|---|---|---|---|---|---|---|---|---|
![]() |
R-5735 |
Available upon quote |
35 |
195 |
3.75 |
31 |
240 |
0.0087 |
1.3[ST] |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.