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  4. Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON4S, MEGTRON4 (Panasonic Industry Co., Ltd.)
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON4S, MEGTRON4-R-5725
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON4S, MEGTRON4-Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON4S, MEGTRON4
Panasonic Industry Co., Ltd.

About This Product

■Multilayer board material “MEGTRON” series for ICT infrastructure equipment

・Multilayer substrate material that supports high-capacity, high-speed transmission of high-frequency signals. ・In addition to low dielectric constant and low dielectric loss tangent, it has high heat resistance and high reliability.

■Low transmission loss/high heat-resistant multilayer board material MEGTRON4S, MEGTRON4

・Supports high-speed transmission of large amounts of data ・Improved heat resistance for high multi-layer and reflow process during board processing (MEGTRON4S)

■Applications

·network ・Wireless communication

■Detailed usage

ICT infrastructure equipment, supercomputers, measurement equipment, communication antennas, etc.

■Main characteristics

・Dk 3.68 Df 0.0074@13GHz (R-5725) ・Tg (DSC) 176℃ (R-5725) ・T288 (with copper) 30 minutes (R-5725)

  • Product

    Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON4S, MEGTRON4

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1 Models of Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON4S, MEGTRON4

Image Part Number Price (excluding tax) T288 (with copper) min Glass transition temperature (Tg) (℃) Dielectric constant (Dk) Thermal expansion coefficient in thickness direction α1 ppm/℃ Thermal expansion coefficient in thickness direction α2 ppm/℃ Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON4S, MEGTRON4-Part Number-R-5725

R-5725

Available upon quote

30

176

3.68 [13GHz]

35

265

0.0074 [13GHz]

1.2 [ST]

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