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  4. Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON6 (Panasonic Industry Co., Ltd.)
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON6-R-5775 (N)
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON6-Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON6
Panasonic Industry Co., Ltd.

About This Product

■Multilayer board material “MEGTRON” series for ICT infrastructure equipment

・Multilayer substrate material that supports high-capacity, high-speed transmission of high-frequency signals. ・In addition to low dielectric constant and low dielectric loss tangent, it has high heat resistance and high reliability.

■Ultra-low transmission loss/high heat-resistant multilayer board material MEGTRON6

・De facto standard for materials for ultra-high performance servers and routers ・Achieves low transmission loss and contributes to improving the performance of ultra-high performance servers and routers

■Applications

·network ・Wireless communication ・Aerospace

■Detailed usage

ICT infrastructure equipment (supercomputers, measurement equipment), antennas (base stations, in-vehicle millimeter wave radar), high frequency applications, aerospace, etc.

■Main characteristics

・Dk 3.34 Df 0.0037@13GHz ・Tg (DSC) 185℃ ・T288 (with copper) >120 minutes

  • Product

    Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON6

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1 Models of Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON6

Image Part Number Price (excluding tax) T288 (with copper) min Glass transition temperature (Tg) (℃) Dielectric constant (Dk) Thermal expansion coefficient in thickness direction α1 ppm/℃ Thermal expansion coefficient in thickness direction α2 ppm/℃ Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment “MEGTRON” series MEGTRON6-Part Number-R-5775 (N)

R-5775 (N)

Available upon quote

>120

185

3.34

45

260

0.0037

0.8

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