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  4. Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series Halogen-free MEGTRON6 (Panasonic Industry Co., Ltd.)
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series Halogen-free MEGTRON6-R-537Y (N)
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series Halogen-free MEGTRON6-Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series Halogen-free MEGTRON6
Panasonic Industry Co., Ltd.

About This Product

■Multilayer board material “MEGTRON” series for ICT infrastructure equipment

・Multilayer substrate material that supports high-capacity, high-speed transmission of high-frequency signals. ・In addition to low dielectric constant and low dielectric loss tangent, it has high heat resistance and high reliability.

■Halogen-free ultra-low transmission loss multilayer board material Halogen-free MEGTRON6

- Added halogen-free properties to de facto standard materials for ultra-high performance servers and routers. ・MEGTRON6: Achieves lower transmission loss than R-5775, contributing to improved performance of ultra-high performance servers and routers.

■Applications

·network ・Wireless communication

■Detailed usage

ICT infrastructure equipment, high-speed communication equipment (high-end servers, routers, optical networks, switches), high multilayer boards, etc.

■Main characteristics

・Dk 3.36 Df 0.0029@13GHz ・Tg (DMA) 250℃ ・T320 (with copper) >120 minutes

  • Product

    Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series Halogen-free MEGTRON6

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1 Models of Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series Halogen-free MEGTRON6

Image Part Number Price (excluding tax) T288 (with copper) min T320 (with copper) min Glass transition temperature (Tg) (℃) Dielectric constant (Dk) Thermal expansion coefficient in thickness direction α1 ppm/℃ Thermal expansion coefficient in thickness direction α2 ppm/℃ Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series Halogen-free MEGTRON6-Part Number-R-537Y (N)

R-537Y (N)

Available upon quote

>120

>120

250

3.36

39

200

0.0029

0.6

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