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  4. Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON8S, MEGTRON8 (Panasonic Industry Co., Ltd.)
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON8S, MEGTRON8-R-579YS (U)
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON8S, MEGTRON8-Panasonic Industry Co., Ltd.

Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON8S, MEGTRON8
Panasonic Industry Co., Ltd.

About This Product

■Multilayer board material “MEGTRON” series for ICT infrastructure equipment

・Multilayer substrate material that supports high-capacity, high-speed transmission of high-frequency signals. ・In addition to low dielectric constant and low dielectric loss tangent, it has high heat resistance and high reliability.

■Ultra-low transmission loss/high heat-resistant multilayer board material MEGTRON8S, MEGTRON8

・Supports next-generation high-speed communication technology 800GbE ・MEGTRON8 R-579Y (U), R-5795 (U) &MEGTRON7 R-578Y (N), R-5785 (N) Improves transmission loss by approximately 30% (at 28GHz), contributing to improved performance of high-speed communication network equipment

■Applications

·network ・Wireless communication

■Detailed usage

Routers, switches, optical transmission equipment, servers, AI servers, base stations, semiconductor test equipment, probe cards, etc.

■Main characteristics

・Dk 3.08 Df 0.0012@14GHz ・Tg (DMA) 220℃ ・T288 (with copper) >120 minutes

  • Product

    Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON8S, MEGTRON8

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1 Models of Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON8S, MEGTRON8

Image Part Number Price (excluding tax) T288 (with copper) min Glass transition temperature (Tg) (℃) Dielectric constant (Dk) Thermal expansion coefficient in thickness direction α1 ppm/℃ Thermal expansion coefficient in thickness direction α2 ppm/℃ Dissipation factor (Df) Copper foil peel strength kN/m
Electronic circuit board materials Multilayer board materials for ICT infrastructure equipment "MEGTRON" series MEGTRON8S, MEGTRON8-Part Number-R-579YS (U)

R-579YS (U)

Available upon quote

>120

220

3.19

35

240

0.0012

0.7[H-VLP3]

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