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  4. Electronic materials for FA mounting [Semiconductor related] Conductive adhesive (Panasonic Industry Co., Ltd.)

Electronic materials for FA mounting [Semiconductor related] Conductive adhesive
Panasonic Industry Co., Ltd.

About This Product

Providing short-curing pastes that can improve productivity and save energy

■Common features of the DBC series

- Hardly any sag or stringiness ・Low temperature (100℃~), short time (180 seconds~) curing ・Easy to work with one-component type ・Does not use solvents that cause bleed-out ・Uses silver filler that has good conductivity and is less affected by oxidation.

  • Product

    Electronic materials for FA mounting [Semiconductor related] Conductive adhesive

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1 Models of Electronic materials for FA mounting [Semiconductor related] Conductive adhesive

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Conductive adhesive

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About Company Handling This Product

Panasonic Industry Co., Ltd.

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