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  4. FA Electronic materials for mounting [For mounting] Low temperature curing conductive adhesive (Panasonic Industry Co., Ltd.)

FA Electronic materials for mounting [For mounting] Low temperature curing conductive adhesive
Panasonic Industry Co., Ltd.

About This Product

■Low-temperature curing process expands the range of parts and base materials that can be used

・Low temperature curing (100℃~180℃) reduces heat damage to parts ・Good conductivity due to silver filler ・Does not use solvents that cause bleed-out

  • Product

    FA Electronic materials for mounting [For mounting] Low temperature curing conductive adhesive

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1 Models of FA Electronic materials for mounting [For mounting] Low temperature curing conductive adhesive

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Low temperature curing conductive adhesive

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Panasonic Industry Co., Ltd.

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