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  4. FA FPD related system COG/FOP combined bonder FPX007CG/FP2 (Panasonic Industry Co., Ltd.)
FA FPD related system COG/FOP combined bonder FPX007CG/FP2-FPX007CGFP2
FA FPD related system COG/FOP combined bonder FPX007CG/FP2-Panasonic Industry Co., Ltd.

FA FPD related system COG/FOP combined bonder FPX007CG/FP2
Panasonic Industry Co., Ltd.

About This Product

■FPX007CG/FP2 is the backbone equipment of the line for flexible organic EL, and is a bonder with various advanced functions such as equipment mechanism that minimizes the source of foreign matter.

・COP/FOP bonder for organic EL that supports panel sizes from 1 inch to 8 inches ・With IC/TCP supply unit attached, supports 4 mounting formats (COG/FOG/COP/FOP) ・Achieving the mounting quality and productivity cultivated through COG mounting for LCD in COP/FOP mounting for organic EL Main functional evolution

■Compatible with cleanliness level 100 (measures against foreign substances)

Equipment mechanism that minimizes the source of foreign matter, which is one of the major causes of defects in flexible organic EL.

■Supports both COP implementation/FOP implementation

Can be equipped with two component supply sections: IC tray/TCP reel. Reduce construction method changeover time

■Stable mounting quality

Equipped with a dedicated crimping head for IC/TCP (*4 heads in total)

  • Product

    FA FPD related system COG/FOP combined bonder FPX007CG/FP2

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1 Models of FA FPD related system COG/FOP combined bonder FPX007CG/FP2

Image Part Number Price (excluding tax) Construction method IC Construction method TCP Organic EL (Flex) Liquid crystal
FA FPD related system COG/FOP combined bonder FPX007CG/FP2-Part Number-FPX007CGFP2

FPX007CGFP2

Available upon quote

COG/COP

FOG/FOP

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Panasonic Industry Co., Ltd.

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