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  4. FA FPD related system COG/FOP combined bonder FPX007CG/FP (Panasonic Industry Co., Ltd.)
FA FPD related system COG/FOP combined bonder FPX007CG/FP-FPX007CG
FA FPD related system COG/FOP combined bonder FPX007CG/FP-Panasonic Industry Co., Ltd.

FA FPD related system COG/FOP combined bonder FPX007CG/FP
Panasonic Industry Co., Ltd.

About This Product

■FPX007CG/FP is a bonder that can be used in a wide range of applications, from narrow frame LCDs to flexible organic EL panels and future COP mounting.

・COG/FOP bonder compatible with panel sizes from 1 inch to 8 inches ・Supports four mounting formats (COG/FOG/FOP/COP) by switching the component supply section ・Achieving the mounting quality and productivity cultivated through COG mounting with FOP mounting ・We have a lineup of forward flow machines (left to right) and reverse flow machines (right to left), realizing factory operation with paired lines.

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    FA FPD related system COG/FOP combined bonder FPX007CG/FP

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1 Models of FA FPD related system COG/FOP combined bonder FPX007CG/FP

Image Part Number Price (excluding tax) Construction method IC Construction method TCP Organic EL (Flex) Liquid crystal
FA FPD related system COG/FOP combined bonder FPX007CG/FP-Part Number-FPX007CG

FPX007CG

Available upon quote

COG/COP

FOG/FOP

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Panasonic Industry Co., Ltd.

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