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Low foam polyethylene Polyelec (Eftron SK) SK-200-SK-200 Thickness 1.0
Low foam polyethylene Polyelec (Eftron SK) SK-200-Sekisui Molding Industry Co., Ltd.

Low foam polyethylene Polyelec (Eftron SK) SK-200
Sekisui Molding Industry Co., Ltd.

Sekisui Molding Industry Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

87.2hours


About This Product

■Protection of semiconductor electronic parts, transportation sheet for electronic parts

It protects semiconductor electronic components from external pressure and vibration during transportation, and is dust-free, rust-proof, and prevents discoloration using carefully selected materials. It is also highly durable and can withstand repeated use. In addition, we also meet the needs of the times, such as antistatic types.

■Features

・Extrusion molded from low-foam polyethylene using proprietary technology to provide excellent cushioning properties. ・It has excellent ionic cleanliness and does not have a negative effect on metals such as lead frames. ・Since it is made of plastic material, there is no need to worry about dust generation. - Light and has appropriate rigidity and workability. ・Extensive lineup of thicknesses to accommodate various electronic components.

■Applications

・Spacer for lead frame ・Interleaf paper for electronic components ・Buffer sheet for other parts

  • Product

    Low foam polyethylene Polyelec (Eftron SK) SK-200

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1 Models of Low foam polyethylene Polyelec (Eftron SK) SK-200

Image Part Number Price (excluding tax) Dimensions (mm) width x length Specific gravity Purpose Color
Low foam polyethylene Polyelec (Eftron SK) SK-200-Part Number-SK-200 Thickness 1.0

SK-200 Thickness 1.0

Available upon quote

1,000 x scroll, 1,000 x 1,000

0.6

Dimensions 1,000 x scroll: core material
Dimensions 1,000 x 1,000: Protective material, packing

White

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About Company Handling This Product

Response Rate

100.0%


Response Time

87.2hrs

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