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  4. Wrapping/polishing device 15 inch LP-15-ODF (Wrap Japan Co., Ltd.)
Wrapping/polishing device 15 inch LP-15-ODF-LP-15-ODF
Wrapping/polishing device 15 inch LP-15-ODF-Wrap Japan Co., Ltd.

Wrapping/polishing device 15 inch LP-15-ODF
Wrap Japan Co., Ltd.

Wrap Japan Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

23.2hours

Relatively Fast Response

About This Product

■Summary

Lap Japan's compact tabletop lapping/polishing equipment is a unique machine that uses an unparalleled free abrasive cutting method to make lapping equipment extremely economical. A large amount of workpieces can be processed at once. As a result, machining efficiency improves, making it possible to reduce the machining unit cost. A superior tabletop lapping/polishing machine that provides better flatness, dimensional control, parallelism, and surface finish than any other method. An optically flat surface and a uniform finish on the micron order can be obtained.

■Facing mechanism

When performing facing processing, the Z-axis of the cutting tool is operated by numerical control. By inputting machining conditions, repeated facing and spiral groove machining can be performed fully automatically. Principle and necessity of Lap Japan water cooling system

■Principle

The Lap Japan water cooling system cools the lap plate by letting industrial water or cooling water whose temperature is controlled by a chiller pass through the water channel in the base plate below the lap plate.

■Necessity

During lapping, polishing heat is generated because the lap plate and workpiece are constantly rubbed together with loose abrasive grains interposed between them. For this reason, if lapping continues for a long time, the lapping plate will expand and the flatness will be damaged, making it difficult to maintain the reproducibility of the flatness of the workpiece. Also, peeling of the wax due to polishing heat becomes a problem. The Lap Japan water cooling system solves all of these major problems by efficiently cooling the lap plate.

  • Product

    Wrapping/polishing device 15 inch LP-15-ODF

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1 Models of Wrapping/polishing device 15 inch LP-15-ODF

Image Part Number Price (excluding tax) Oscillation drive Number of slurry supply systems Facing mechanism Plate cooling mechanism Plate rotation speed Plate diameter Correction ring diameter Control method Pressure method Forced drive drive Required power supply Operation panel Equipment dimensions Weight
Wrapping/polishing device 15 inch LP-15-ODF-Part Number-LP-15-ODF

LP-15-ODF

Available upon quote

3 axis

1~3 strains

Standard

Standard

5rpm~240rpm

Φ300~380

Φ138

PLC sequence

Pressurized cylinder

3 axis

200V 50/60Hz

Touch panel

W650×D620×H400

750kg

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About Company Handling This Product

Wrap Japan Co., Ltd.

Response Rate

100.0%

Response Time

23.2hrs

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Wrap Japan Co., Ltd.

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