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  2. Analysis and management Film thickness measurement Electrolytic plating thickness measuring device THICKNESS TESTER TH-11 type (Sanko Shokai Co., Ltd.)
Analysis and management Film thickness measurement Electrolytic plating thickness measuring device THICKNESS TESTER TH-11 type-TH-11
Analysis and management Film thickness measurement Electrolytic plating thickness measuring device THICKNESS TESTER TH-11 type-Sanko Shokai Co., Ltd.

Analysis and management Film thickness measurement Electrolytic plating thickness measuring device THICKNESS TESTER TH-11 type
Sanko Shokai Co., Ltd.

About This Product

Essential items for plating quality control (ISO), shipping inspection, receiving inspection, and research and development. It is possible to save data, search data, and create reports by communicating with a computer.

■Features

・This is a destructive measuring instrument that is useful for plating quality control, etc., and can measure a wide variety of plating types. - Can measure copper, nickel, chromium, zinc, tin, silver, gold, copper-zinc alloy, and tin-lead alloy plating. With the optional electrolyte, cadmium, electroless nickel (Ni-P), tin-zinc alloys, lead, and iron plating can also be measured. -Easy to operate as it is interactive with easy to read messages. ・Errors will also be notified by message display. ・Messages are displayed in easy-to-understand Japanese. English display is also available as an option. - By connecting to a computer, you can save, search, print, and create reports on measurement results. ・50 measurement results can be stored and displayed on the main unit. ・Measurement results can be printed by selecting from 50 memorized points using an optional printer. ・Automatically performs gasket calibration value settings, alloy ratio conversion, reverse electrolysis operations, etc. - This is a measuring instrument that complies with the measurement method stipulated in the Japanese Industrial Standard (JIS H8501).

■Measurement function overview

The gasket attached to the cell is applied to the plating surface to limit the electrolysis area, and an electrolyte suitable for the plating metal and substrate is injected into the cell. Using the plated object as the anode and the cell as the cathode, the plated metal is melted by flowing a high-precision current according to the plated metal. The change in electrolytic voltage that occurs when all the plating metal is melted and the underlying metal is exposed is detected, and the plating thickness is calculated based on the time required to melt the plating metal.

■Measuring speed, plating type

・Unit 0.1: 0.2μm/s, Cu, Ni, Zn, Sn, Cu-Zn, Sn-Pb, Sn-Zn. ・Unit 0.1: 0.1 μm/s, Cr, Cu/Zn, Ag, Au, Pb, Fe, Cd, Ni-P. ・Unit: 0.01: 0.02μm/s, all types above.

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    Analysis and management Film thickness measurement Electrolytic plating thickness measuring device THICKNESS TESTER TH-11 type

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1 Models of Analysis and management Film thickness measurement Electrolytic plating thickness measuring device THICKNESS TESTER TH-11 type

Image Part Number Price (excluding tax) Ambient temperature Size Method Measuring range Measurement accuracy Measuring area Guaranteed accuracy Mass Communication output Power supply Electrolytic current accuracy
Analysis and management Film thickness measurement Electrolytic plating thickness measuring device THICKNESS TESTER TH-11 type-Part Number-TH-11

TH-11

Available upon quote

10~40℃

W250mm, D215mm, H110mm

Micro area electrolytic test method

Unit 0.1: 2.0~400.0μm
Unit 0.01: 0.05~4.00μm

Thickness measurement: ±5%

Gasket L: 10㎟, Gasket S: 5㎟

Unit 0.1: 4.0~30.0μm
Unit 0.01: 0.40~2.00μm

2.3kg

Printer: Centronics compliant
Computer: RS232C compliant

AC90~260V, 50/60Hz, 1φ35VA or less

±0.5% (25℃)

About Company Handling This Product

Sanko Shokai Co., Ltd.

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