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  2. Surface treatment chemicals tin/solder plating NPL-110 (Sanko Shokai Co., Ltd.)

Surface treatment chemicals tin/solder plating NPL-110
Sanko Shokai Co., Ltd.

About This Product

■Product overview

For wafer bumps.

■Applications

・Plating for wafer bumps. ・Ni plating.

■Features

This Ni plating process is ideal for UBM for Sn-based bumps, and has excellent surface smoothness.

  • Product

    Surface treatment chemicals tin/solder plating NPL-110

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1 Models of Surface treatment chemicals tin/solder plating NPL-110

Image Part Number Price (excluding tax)

NPL-110

Available upon quote

About Company Handling This Product

Sanko Shokai Co., Ltd.

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