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History

Surface treatment chemicals Copper plating Copper sulfate plating Lucent copper SVF
Sanko Shokai Co., Ltd.


About This Product

■Product overview

Chemicals for printed wiring boards.

■Applications

Copper sulfate plating additive for via fill. Insoluble anode type.

■Features

・Excellent filling performance at low film thickness. ・Excellent filling performance in high current density areas. - Compatible with through-hole mixed boards.

  • Product

    Surface treatment chemicals Copper plating Copper sulfate plating Lucent copper SVF

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