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Surface treatment chemicals Plating chemicals Electroless copper plating (cyan-free) for build-up boards Surcup PEAV6
Sanko Shokai Co., Ltd.


About This Product

■Product overview

Electroless copper plating for build-up boards.

■Applications

Electroless copper plating (cyanide free).

■Features

Low-stress electroless copper bath, compatible with SAP build-up boards, next-generation small diameter vias.

  • Product

    Surface treatment chemicals Plating chemicals Electroless copper plating (cyan-free) for build-up boards Surcup PEAV6

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