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Surface treatment chemicals Plating chemicals For build-up boards Electroless copper plating (cyan-free) Surcup PEAV4
Sanko Shokai Co., Ltd.


About This Product

■Product overview

Electroless copper plating for build-up boards.

■Applications

Electroless copper plating (cyanide free).

■Features

Low-stress electroless copper bath, compatible with SAP build-up substrates, next-generation fine pattern.

  • Product

    Surface treatment chemicals Plating chemicals For build-up boards Electroless copper plating (cyan-free) Surcup PEAV4

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1 Models of Surface treatment chemicals Plating chemicals For build-up boards Electroless copper plating (cyan-free) Surcup PEAV4

Image Part Number Price (excluding tax) EDTA free Temperature Gravimetric precipitation rate

Sur cup PEAV4

Available upon quote

26℃

0.4μm/15min

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