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  2. Surface treatment chemicals Plating chemicals For build-up boards Electroless copper plating (cyan-free) Surcup PEAV3 (Sanko Shokai Co., Ltd.)

Surface treatment chemicals Plating chemicals For build-up boards Electroless copper plating (cyan-free) Surcup PEAV3
Sanko Shokai Co., Ltd.

About This Product

■Product overview

Electroless copper plating for build-up boards.

■Applications

Electroless copper plating (cyanide free).

■Features

Low stress electroless copper bath, compatible with SAP build-up substrates, improved uniform plating film thickness.

  • Product

    Surface treatment chemicals Plating chemicals For build-up boards Electroless copper plating (cyan-free) Surcup PEAV3

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1 Models of Surface treatment chemicals Plating chemicals For build-up boards Electroless copper plating (cyan-free) Surcup PEAV3

Image Part Number Price (excluding tax) EDTA free Temperature Gravimetric precipitation rate

Sur cup PEAV3

Available upon quote

○

33℃

0.6μm/15min

About Company Handling This Product

Sanko Shokai Co., Ltd.

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