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  2. Surface treatment chemicals Plating chemicals For wafers Tin plating Evasolder BUⅡ (Sanko Shokai Co., Ltd.)

Surface treatment chemicals Plating chemicals For wafers Tin plating Evasolder BUⅡ
Sanko Shokai Co., Ltd.

About This Product

■Product overview

Tin plating - for bumps.

■Applications

Plating chemicals for semiconductor wafers.

■Features

Easy liquid management.

  • Product

    Surface treatment chemicals Plating chemicals For wafers Tin plating Evasolder BUⅡ

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1 Models of Surface treatment chemicals Plating chemicals For wafers Tin plating Evasolder BUⅡ

Image Part Number Price (excluding tax)

Eva Solder BUⅡ

Available upon quote

About Company Handling This Product

Sanko Shokai Co., Ltd.

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