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Surface treatment chemicals Plating chemicals Copper sulfate plating for wafers BU2HA
Sanko Shokai Co., Ltd.

Sanko Shokai Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

7.6hours

Fast Response


About This Product

■Product overview

Copper sulfate plating - for rewiring and bumps.

■Applications

Plating chemicals for semiconductor wafers.

■Features

Glossy type, bump top is flat.

  • Product

    Surface treatment chemicals Plating chemicals Copper sulfate plating for wafers BU2HA

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1 Models of Surface treatment chemicals Plating chemicals Copper sulfate plating for wafers BU2HA

Image Part Number Price (excluding tax)

BU2HA

Available upon quote

About Company Handling This Product

Response Rate

100.0%


Response Time

7.6hrs

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