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Surface treatment chemicals Plating chemicals Copper sulfate plating for wafers XP-CS
Sanko Shokai Co., Ltd.


About This Product

■Product overview

Copper sulfate plating - for fine wiring and bumps.

■Applications

Plating chemicals for semiconductor wafers.

■Features

Matte type, one-component, easy to manage, sulfur-free.

  • Product

    Surface treatment chemicals Plating chemicals Copper sulfate plating for wafers XP-CS

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1 Models of Surface treatment chemicals Plating chemicals Copper sulfate plating for wafers XP-CS

Image Part Number Price (excluding tax)

XP-CS

Available upon quote

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