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  2. Surface treatment chemicals Plating chemicals Tin/silver plating for wafers JSOLDER BUHD (Sanko Shokai Co., Ltd.)

Surface treatment chemicals Plating chemicals Tin/silver plating for wafers JSOLDER BUHD
Sanko Shokai Co., Ltd.

Sanko Shokai Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

7.6hours

Fast Response

About This Product

■Product overview

Tin/silver plating - for bumps.

■Applications

Plating chemicals for semiconductor wafers.

■Features

Semi-gloss type, stable Ag precipitation ratio, uniform electrodeposition, and excellent reflow properties.

  • Product

    Surface treatment chemicals Plating chemicals Tin/silver plating for wafers JSOLDER BUHD

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1 Models of Surface treatment chemicals Plating chemicals Tin/silver plating for wafers JSOLDER BUHD

Image Part Number Price (excluding tax)

JSOLDER BUHD

Available upon quote

About Company Handling This Product

Sanko Shokai Co., Ltd.

Response Rate

100.0%

Response Time

7.6hrs

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