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Surface treatment chemicals Plating chemicals Tin/silver plating for wafers JSOLDER BUHD
Sanko Shokai Co., Ltd.


About This Product

■Product overview

Tin/silver plating - for bumps.

■Applications

Plating chemicals for semiconductor wafers.

■Features

Semi-gloss type, stable Ag precipitation ratio, uniform electrodeposition, and excellent reflow properties.

  • Product

    Surface treatment chemicals Plating chemicals Tin/silver plating for wafers JSOLDER BUHD

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1 Models of Surface treatment chemicals Plating chemicals Tin/silver plating for wafers JSOLDER BUHD

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JSOLDER BUHD

Available upon quote

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