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  4. Next generation rework equipment ReworkStation MS9000SE (Meisho Co., Ltd.)
Next generation rework equipment ReworkStation MS9000SE-MS9000SE
Next generation rework equipment ReworkStation MS9000SE-Meisho Co., Ltd.

Next generation rework equipment ReworkStation MS9000SE
Meisho Co., Ltd.

About This Product

We make a wide variety of rework tasks ``skillless''.

■Two models available (semi-auto/manual)

You can choose automatic functions depending on the content of the rework. "Auto" is effective for mass rework of the same parts, and "semi-auto" is effective for random parts. If you use the "Auto" function, you can complete the data necessary for rework by following the wizard, and just press "Start" and the machine will automatically perform the rework.

■Three features: “Skillless”

Equipped with a function that allows you to complete the steps that require the most experience and skill in rework work with simple settings.

■Temperature profile automatic acquisition

Our in-house developed ITTSⅡ (Automatic Temperature Tracking System) allows us to simultaneously obtain the temperature profile of the board while removing parts.

■Positioning function

The work of positioning parts, which used to take time and effort, is now completely skill-free using our proprietary image processing technology, pattern matching, and visual move functions.

■Solder cleaning

The equipment's heater supplies heating power that cannot be produced with conventional hand tools such as soldering irons, and suctions out sufficiently melted solder.

■Functional expansion available

We offer a variety of expansion functions to support increasingly diverse and complex electronic boards and components. New functions can be added freely even after the equipment is installed.

■IR heater unit

In addition to the standard hot air system, an IR (infrared) heater unit can be installed. □Even large component connectors of 35mm or more and tall components/boards can be heated at a uniform temperature to avoid melting of the components.

■New sand dip tool

BGA/CSP bump printing and maskless transfer are possible with one jig.

■Chip unit

When the chip unit is installed, it is possible to rework chip parts such as 0402 to 0603.

■High resolution camera

By adding a high-resolution external camera, you can clearly observe the condition of boards and components.

■Achieves both accuracy within 20μm and ease of use

It boasts high accuracy with flatness, squareness, and parallelism: within 20 μm, and Z-axis repeatability: within 10 μm.

■PCB clamper

To adjust the position by moving the board, securely fix the board with a clamper.

■N2 generator

Through heating, it is possible to improve the quality of the solder surface, including oxidation, wettability, sagging, solder melting time, bonding reliability, and gloss.

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    Next generation rework equipment ReworkStation MS9000SE

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1 Models of Next generation rework equipment ReworkStation MS9000SE

Image Part Number Price (excluding tax)
Next generation rework equipment ReworkStation MS9000SE-Part Number-MS9000SE

MS9000SE

Available upon quote

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