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  1. Metoree
  2. Semiconductor Manufacturing
  3. Microelectronics & Semiconductor Packages
  4. Semiconductor package substrate (Printec Co., Ltd.)
Semiconductor package substrate-Semiconductor package substrate
Semiconductor package substrate-Printec Co., Ltd.

Semiconductor package substrate
Printec Co., Ltd.

About This Product

We use highly heat-resistant bismaleimide materials to provide highly reliable and high-performance semiconductor package substrates that have both high heat resistance and low warpage. ◼︎Features ・High heat resistance of Tg300℃ Due to the IPN structure, the main chain of high Tg components maintains overall rigidity. ・Micro-fabrication technology that enables miniaturization and thinning We provide highly adhesive semiconductor package substrates that combine layering technology and microfabrication technology. ・High quality and high reliability By using materials with excellent heat resistance, electrical properties, and physical properties, we provide semiconductor package substrates with high quality and long-term reliability. ◼︎Applications IC-PKG, CSP, FC-BGA, etc.

  • Product

    Semiconductor package substrate

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1 Models of Semiconductor package substrate

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Semiconductor package substrate-Part Number-Semiconductor package substrate

Semiconductor package substrate

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Printec Co., Ltd.

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Microelectronics & Semiconductor Packages
Microelectronics & Semiconductor Packages　Printec Co., Ltd.
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