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Ultra-high heat-resistant bismaleimide resin HR series HR-YSPL
Printec Co., Ltd.


About This Product

Our original bismaleimide resin provides high reliability due to its extremely high heat resistance. In addition, bismaleimide is generally difficult to dissolve in general-purpose solvents, but the HR series can dissolve over 70% solids in MEK, etc., so it can be used in a variety of applications. HR-YSPL is a product with reduced hardening agent of HR-YSP. This is a unique bismaleimide resin that has excellent heat resistance and low dielectric properties, and is stably soluble in solvents at room temperature. ◼︎Features ・Ultra high heat resistance It develops a Tg of 280℃ or more, contributing to improved reliability in various situations. ・Solvent solubility It does not require environmentally hazardous solvents such as NMP or DMAc. ・Low softening temperature Although it is a high heat resistant resin, it has a softening temperature of less than 100℃, making it easy to work with. ◼︎Applications Semiconductor package substrates, power semiconductor EMC, heat-resistant paints, high-speed communication substrates (5G/6G), CFRP/GFRP

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    Ultra-high heat-resistant bismaleimide resin HR series HR-YSPL

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