Ultra-high heat-resistant bismaleimide resin HR series HR-YSPL
Printec Co., Ltd.

About This Product

Our original bismaleimide resin provides high reliability due to its extremely high heat resistance. In addition, bismaleimide is generally difficult to dissolve in general-purpose solvents, but the HR series can dissolve over 70% solids in MEK, etc., so it can be used in a variety of applications.

HR-YSPL is a product with reduced hardening agent of HR-YSP. This is a unique bismaleimide resin that has excellent heat resistance and low dielectric properties, and is stably soluble in solvents at room temperature.

◼︎Features
・Ultra high heat resistance
It develops a Tg of 280℃ or more, contributing to improved reliability in various situations.

・Solvent solubility
It does not require environmentally hazardous solvents such as NMP or DMAc.

・Low softening temperature
Although it is a high heat resistant resin, it has a softening temperature of less than 100℃, making it easy to work with.

◼︎Applications
Semiconductor package substrates, power semiconductor EMC, heat-resistant paints, high-speed communication substrates (5G/6G), CFRP/GFRP

Model
There is 1 model available for this product.

Product
Ultra-high heat-resistant bismaleimide resin HR series HR-YSPL

Handling Company
Printec Co., Ltd.

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1 Models of Ultra-high heat-resistant bismaleimide resin HR series HR-YSPL

Image	Part Number	Price (excluding tax)
	HR-YSPL	Available upon quote

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Part Number

Price (excluding tax)

HR-YSPL

Available upon quote

About Company Handling This Product

Ultra-high heat-resistant bismaleimide resin HR series HR-YSPL Printec Co., Ltd.

About This Product

1 Models of Ultra-high heat-resistant bismaleimide resin HR series HR-YSPL

HR-YSPL

Other products of Printec Co., Ltd.

About Company Handling This Product

Ultra-high heat-resistant bismaleimide resin HR series HR-YSPL
Printec Co., Ltd.